Semiconductors
Top stories summarized by our editors
11/20/2017

Industry sources predict Huawei Technologies, Xiaomi Technology, Oppo Electronics and other Android smartphone vendors will incorporate 3D sensing capabilities in their 2018 models. The 3D sensing chips were developed jointly by Qualcomm, Truly Opto-electronics and Himax Technologies.

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DigiTimes
11/20/2017

Samsung Electronics is expected to have 2017 chip sales of $65.6 billion, topping Intel's $61 billion, IC Insights estimates. The firm predicts SK Hynix will take third place and Micron Technology fourth with $26.2 billion and $23.4 billion, respectively.

11/20/2017

STMicroelectronics has introduced the ultra-low-power STM32L4+ line of microcontrollers, meant for use in fitness bands, industrial sensors, medical devices, smart meters and smartwatches. The new MCUs are based on an Arm Cortex-M core.

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EE Times
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STMicroelectronics
11/20/2017

Multiple microchips stacked in a single package represent the semiconductor industry's answer to technical challenges in capabilities, performance and power consumption, Christopher Mims writes. The technology is commonly used with memory chips and is being adopted with different kinds of chips stacked in one package.

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memory chips, Christopher Mims
11/20/2017

ROHM Semiconductor brought out the automotive-grade BA8290xYxx-C line of noise-tolerant operational amplifiers. The AEC-Q100-qualified op-amps can operate in temperatures of minus-40 degrees C to 125 degrees C.

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New Electronics
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Rohm Semiconductor, Rohm
11/17/2017

Intel is betting big on 5G with new plans to build a family of 5G radio modems capable of transferring data wirelessly at multiple gigabits per second. The chips are scheduled for rollout in 2019 and will be part of a portfolio of Intel products for 5G, a service that's expected to deploy widely in 2020.

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VentureBeat, EE Times
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Intel
11/17/2017

Qualcomm's proposed $47 billion acquisition of NXP Semiconductors may get the green light from EU antitrust regulators before the end of this year, Bloomberg reports. Qualcomm has reportedly pledged not to include NXP's standard essential and system-level patents in the transaction, one source says.

11/17/2017

Samsung Electronics will invest $26 billion in its chip-making facilities this year, leading the industry's worldwide capital expenditures of $90.8 billion, IC Insights estimates. By the end of 2017, the Korean company will have spent $14 billion on wafer fabrication facilities for 3D NAND flash memory devices, $7 billion for DRAM fabs and $5 billion for its silicon foundry business, according to the market research firm.

11/17/2017

Carlo Bozotti, president and CEO of STMicroelectronics, said at a conference in Barcelona, that his company is enjoying very positive revenue growth this year, while warning that industry observers should not talk about a "supercycle" for the semiconductor business. Analysts predict STMicroelectronics will post 2017 revenue growth of about 17% to approximately $8.2 billion.

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Reuters
11/17/2017

Microfluidic channel-hosted dispersions of 2D semiconductor materials can be integrated with silicon-based photonic devices, said Anna Baldycheva, a professor at the UK's University of Exeter. "We intend to continue investigating applications of fluid-dispersed nanosheets for silicon photonics," said Baldycheva, the research team leader.

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NanotechWeb (U.K.)