Semiconductors
Top stories summarized by our editors
9/21/2017

GlobalFoundries announced a 12-nanometer FinFET process that Advanced Micro Devices and other customers can use as a transition between the 14/16nm and 10nm process nodes. The 12nm process can provide a 10% improvement in chip performance without a complete redesign, the foundry said.

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VentureBeat
9/21/2017

Tesla is reportedly developing an artificial-intelligence chip for autonomous driving with help from Advanced Micro Devices, says a source familiar with the matter. GlobalFoundries is expected to fabricate the AI chip for Tesla, although the foundry declined to comment on customers or potential customers.

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CNBC
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Tesla, Advanced Micro Devices, AI
9/21/2017

While photomasks for immersion lithography systems are basically interchangeable, this is not yet true for the next-generation extreme ultraviolet scanners, this analysis notes. "The big impact here is time," said Ben Rathsack of TEL.

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EUV lithography
9/21/2017

Prototyping with field-programmable gate arrays can help hasten the design verification process, Juergen Jaeger of Cadence Design Systems writes. "Having a solution at hand that cuts the bring-up time from several months to a couple of weeks by automating most of the process, will accelerate time-to-market by months," he concludes.

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Cadence Design Systems
9/20/2017

Intel will offer its partners and foundry customers in China access to the chipmaker's 14-nanometer process technology and its lower-cost 22FFL process. "Both China's semiconductor production and consumption revenues continued to outpace those of the global market, further solidifying its position as a key player in the chip sector," Intel's Zane Ball said.

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China Daily (Beijing)
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Intel, Global Market, chipmaker
9/20/2017

Toshiba's flash memory chip unit will be sold to a consortium led by Bain Capital for $18 billion after the group's bid was accepted by Toshiba's board. Apple, SK Hynix, Dell and Japan's Hoya Corp. are expected to offer financial support for the deal.

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Bloomberg, Reuters
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Bain group, Toshiba
9/20/2017

Toshiba Electronics Europe has brought out a reference design board for its TZ1200 App-Lite graphics processor. The chip could go into internet of things devices and wearable gadgets.

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New Electronics
9/20/2017

The new xSPI JEDEC standard for nonvolatile memories is meant for instant-on applications, and maintains the performance of NOR flash memory external to system-on-a-chip devices. Adesto Technologies has incorporated the JEDEC standard in its eXecute-in-Place EcoXiP product line.

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EE Times
9/20/2017

Chip and system designers are encountering new issues with peak power as designs become more complicated, this analysis notes. "When you turn them on from sleep to function mode, that will increase the in-rush current, and the current will spike because it turns everything on," said Jerry Zhao of Cadence Design Systems.

9/19/2017

Intel has been working with Alphabet's Waymo to produce technology that can measure real-time information in autonomous cars. The agreement signals that Intel is further expanding its reach into autonomous-car technology after its $15 billion purchase of Mobileye in March, Alexandria Sage writes.

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Reuters
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Intel, Waymo, Mobileye